AMD OPTERON-6272 16 Core Processor

AMD Part #/MPN: OPTERON-6272

DiscTech Item #: AMD-OPTERON-6272-BN-OE


$125.00
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$125.00

Interface Types: Socket G34

Electrical Interface: Clock 2.1 - 2.19 GHz

On-Board Cache: 16MB

Wattage/VA: 80W

AMD Opteron OPTERON-6272 2.1 GHz 16 Core 32MB L2 + L3 Cache Processor - Socket G34 - Brand New

AMD Opteron OPTERON-6272 2.1 GHz 16 Core / HexaDeca-Core 32MB L2 + L3 (16MB L2 / 16MB L3) Cache Processor - Socket G34 - Brand New

Alt Model#: OS6272WKTGGGU, OS6272WKTGGGUWOF
IBM / Lenovo Model#: 90Y5374

AMD proudly presents the new AMD Opteron 6200 Series—the world’s first and only 16-core x86 server processor with the highest core density for incredible scalability to handle demanding multi-threaded workloads such as cloud computing, virtualization, high-performance computing (HPC), databases and business applications.

The innovative modular architecture helps pack in more cores, making it the natural choice for heavy-threaded cloud computing environments and enterprise applications that demand outstanding performance and scalability.

  • NEW CORE ARCHITECTURE DRIVES MORE CORE DENSITY AND GREATER THROUGHPUT -The modular design features up to 33% more cores and 35% greater performance in a smaller silicon footprint than AMD’s current products, bringing high performance throughput for scalable computing environments like virtualization, HPC, web/cloud clusters and database applications. AMD has designed several new features, including AMD Turbo CORE technology, ISA Enhancements and Flex FP, into its processors so that datacenters can maximize their performance potential.
  • AMD TURBO CORE TECHNOLOGY - AMD Turbo CORE Technology allows processors to independently boost their clock speeds, scaling frequency up 500MHz-1GHz automatically to respond to the need for more application performance.
  • AMD-P 2.0 - The AMD-P suite of energy-efficient technologies helps customers maximize the performance per watt in their datacenter and can help lower power and cooling costs. TDP Power Cap allows user to set the maximum processor power ceiling via BIOS or APML to meet power and workload demands. C6 Power State reduces processor power consumption at active idle by up to 37% while AMD CoolSpeed Technology protects processor integrity by reducing power-states, when a temperature limit is reached. Other features include C1E, LV-DDR3 support and APML (Advanced Platform Management Link) which provides an interface for processor and systems management monitoring and controlling of system resources (in APML-enabled platforms).
  • HYPERTRANSPORT 3.0 TECHNOLOGY WITH HT ASSIST - HyperTransport Technology (HT or HTT) is a high-speed, low latency, point-to-point link designed to increase communication speeds between integrated circuits in computers, servers, embedded systems, and networking and telecommunications equipment. HT 3.0 technology offers the processor up to a maximum 6.4GT/s interconnect rate. HT Assist helps to increase coherent memory bandwidth and reduce latency in multi-node systems by reducing cache probe traffic between cores, resulting in faster queries that can increase performance for cache sensitive applications such as database, virtualization, and compute intensive applications.
  • QUAD CHANNEL MEMORY SUPPORT - The AMD Opteron 6200 Series supports quad-channel memory (U/RDDR3, ULV RDDR3 and LRDIMM) that delivers up to 102.4 GB/s memory bandwidth per CPU for Socket G34 for increased performance especially in memory-intensive workloads. LR-DIMMs provide more capacity per DIMM, which can enable higher overall server memory configurations. Virtualization, cloud computing and other high-capacity applications greatly benefit from LR-DIMMs.
  • AMD VIRTUALIZATION (AMD-V) 2.0 -AMD Virtualization (AMD-V) is a set of unique on-chip features that help AMD processor-based servers and clients run multiple operating systems and applications on a single machine by improving the efficiency of virtualization software. AMD Virtualization (AMD-V) Technology 2.0 heightens virtualization efficiency with new enhancements to the AMD-V suite of virtualization to optimize data center rack space and help minimize management tasks.

AMD Opteron 6272
Model NumberOPTERON-6272
Alt Model NumberOS6272WKTGGGU
OS6272WKTGGGUWOF
IBM Model Number90Y5374
General information
TypeCPU / Microprocessor
Market segmentServer
FamilyAMD Opteron 6200 series
Frequency2100 MHz
Maximum turbo frequency
  • 2400 MHz (more than 8 cores)
  • 3000 MHz (8 cores or less)
  • Bus speed3200 MHz HyperTransport links (6.4 GT/s per link)
    Package1944-land lidded organic Land Grid Array (LGA)
    SocketSocket G34
    Architecture / Microarchitecture
    MicroarchitectureBulldozer
    PlatformMaranello
    Processor coreInterlagos
    Core steppingOR-B2
    CPUID600F12
    Manufacturing process0.032 micron silicon-on-insulator (SOI) technology
    Die316mm
    Data width64 bit
    The number of CPU cores16
    The number of threads16
    Floating Point UnitIntegrated (shared between two cores in each module)
    Level 1 cache size
  • 8 x 64 KB 2-way set associative shared instruction caches
  • 16 x 16 KB 4-way set associative data caches
  • Level 2 cache size8 x 2 MB 16-way set associative shared exclusive caches
    Level 3 cache size2 x 8 MB up to 64-way set associative shared caches
    Cache latency3 (L1 cache)
    MultiprocessingUp to 4 processors
    Features
  • MMX instructions
  • Extensions to MMX
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • SSE4a
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • FMA4 / 4-operand Fused Multiply-Add instructions
  • XOP / eXtended Operations instructions
  • AMD64 / AMD 64-bit technology
  • AMD-V 2.0 / AMD Virtualization technology 2.0
  • EVP / Enhanced Virus Protection
  • Turbo Core technology
  • Low power featuresAMD-P 2.0:
  • Core C1, C1E, C6 and CC6 states
  • Package S3, S4 and S5 states
  • TDP power cap
  • Integrated peripherals / components
    Integrated graphicsNone
    Memory controller
  • The number of controllers: 2
  • Memory channels per controller: 2
  • Channel width (bits): 72
  • Supported memory: UDDR3-1600, RDDR3-1600, ULV RDDR3-1333, LRDIMM-1333
  • DIMMs per channel: 3
  • Maximum memory bandwidth (GB/s): 51.2
  • Other peripheralsHyperTransport 3.0 technology with 4 HT links
    Electrical / Thermal parameters
    Maximum operating temperature55°C - 69°C
    Average CPU Power80 Watt
    Thermal Design Power115 Watt

    ROHS Compliant

    Alternate MPNs: 90Y5374 OS6272WKTGGGU OS6272WKTGGGUWOF

    Weight: 1 lb

    Warranty: 1 Year DiscTech

    Brand New

    Condition Levels Explained

    The product is brand new.

    1 Year DiscTech Warranty

    Product Warranties Explained

    The product has a DiscTech warranty for the time period specified. View our limited warranty